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| RTL8201CP-VD-LF资料 | |
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RTL8201CP-VD-LF PDF Download |
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File Size : 116 KB
Manufacturer:REALTEK Description: The power dissipation of the SOT-563 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipa- tion. Power dissipation for a surface mount device is deter- mined by TJ(max), the maximum rated junction temperature of the die, RqJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Us- ing the values provided on the data sheet for the SOT-563 package, PD can be calculated as follows: |
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| 相关型号 | |
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| ◆ RTL8196E-VE1-CG | |
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| ◆ RTL8201BL-LF | |
| ◆ RTL8201CP-VD-LF | |
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| ◆ RTL8211FI-CG | |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：RTL8201CP-VD-LF 厂 家：REALTEK 封 装：LQFP48 批 号：23+ 数 量：5000 说 明： RTL8201CP-VD-LF现货 |
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运 费： 所在地： 新旧程度： |
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